Intel Unveils Research To Pack More Computing Power In Chips Beyond 2025


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| Update:
Dec. 12, 2021, 2:10 p.m.


Intel’s Research Components Group presented the work in papers at an international conference to be held in San Francisco. The Silicon Valley company is working to regain its lead in making the smallest, fastest chips it has lost in recent years to rivals like Taiwan Semiconductor Manufacturing Co and Samsung Electronics Co Ltd, Reuters reports .

While Intel CEO Pat Gelsinger outlined business plans to recapture that lead by 2025, the research unveiled on Saturday provides a glimpse of how Intel plans to compete beyond 2025.

One of the ways that Intel is putting more computing power into chips by stacking three-dimensional “tiles” or “chips” rather than creating two-dimensional one-piece chips. Intel showed work on Saturday that could allow 10 times more connections between stacked tiles, meaning more complex tiles can be stacked on top of each other.

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