Josh Park attracts NSF grant for heat reduction research in electronics – NEA Report

JONESBORO — An assistant professor of mechanical engineering at Arkansas State University is pursuing research with NASA’s Johnson Space Center on how to more effectively reduce heat buildup in electronic systems.

Dr. Jeongmoon (Josh) Park’s grant proposal was approved by the National Science Foundation’s RII Track-4: Fellows Advancing Science and Technology (FAST) program for $174,864.

Before joining the faculty of the College of Engineering and Computer Science in 2021, Park completed her Ph.D. at Texas A&M, his master’s degree at Purdue and his bachelor’s degree at Korea Aerospace University.

Park of Dr. Jeongmoon (Josh)
Assistant Professor of Mechanical Engineering

He noted that the rapid development of technology has resulted in higher performance and smaller size in electronics. However, with increased circuit density and faster operating frequency, more heat is dissipated and must be removed.

The success of this project will lead to improved thermal performance of cold plates, thereby reducing the size and weight of equipment and saving energy.

“Traditional heat removal systems using a heat sink and fan often become insufficient to keep modern electronics at operating temperature, he explained in his grant proposal. “Therefore, this research is driven by the need to develop an advanced thermal management system to sufficiently remove the dissipated heat and keep the electronics below operating temperature, for better performance and greater reliability.”

In collaboration with NASA’s Johnson Space Center, it will design and develop an advanced cold plate heat exchanger that can remove heat more efficiently using vortex generators, an aerodynamic element, especially for spacecraft electronics inhabited.

Cold plates have coolant flow passages bounded by metal walls. The use of vortex generators in flow passages has great potential to improve heat transfer, Park continued.

“When better liquid cooling in the cold plates is achieved, it can lead to significant energy savings as well as a reduction in equipment size and weight. Ultimately, this research can support the design, development and implementation of the next generation of thermal management systems for electronics in space applications.

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